Bambu Lab ABS - White

Bambu Lab ABS

1.75 mm ± 0.03 | 87°C Heat Deflection | High Impact Resistance | Water-Resistant | 240-270°C | 1KG RFID Spool

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Bambu Lab ABS - Tough, Heat-Resistant Engineering Filament

Stronger than PLA and PETG, holds up to 87°C, and shrugs off impacts, water and UV.

ABS is the classic technical material for functional 3D printing — high temperature resistance, UV resistance and water resistance — but it traditionally warps easily and smells while printing. Bambu ABS is formulated to reduce warping and cracking while keeping outstanding impact resistance, and its good flow behaviour makes it well suited to high-speed printing.

Why makers pick Bambu ABS

  • Tough and durable — 39.3 kJ/m² impact strength, survives repeated drops and collisions
  • Heat deflection temperature of 87°C — far above PLA (57°C) and PETG (69°C)
  • Water-resistant and UV-resistant for long-lasting parts, even in wet environments
  • Good impact resistance even at low temperatures
  • 1.75 mm ± 0.03 mm diameter on a high-temperature reusable spool with RFID
  • Tuned for reduced warping and cracking versus generic ABS

What you need to print it

ABS requires an enclosed printer and a glued build plate (Engineering, High Temperature or Textured PEI). Run the nozzle at 240-270°C with an 80-100°C bed. It is compatible with AMS 2 Pro, AMS HT and AMS — but not AMS lite. Print in a well-ventilated area: ABS releases pungent odours while printing.

Key Features

Tough and durable — 39.3 kJ/m² impact strength, stronger than PLA and PETG

Heat deflection temperature of 87°C for functional, high-temp parts

Water-resistant and UV-resistant — built to last, even in wet environments

Tuned to reduce the warping and cracking of generic ABS

High-temperature reusable RFID spool — AMS 2 Pro / AMS HT / AMS compatible

Requires an enclosed printer · 240-270°C nozzle · 80-100°C bed

Technical Specifications

Bambu Lab ABS

Mechanical Properties

Density1.05 g/cm³
Tensile Strength
(X-Y)
33 ± 3 MPa
Young's Modulus
(X-Y)
2200 ± 190 MPa
Breaking Elongation Rate
(X-Y)
10.5 ± 1.0 %
Bending Strength
(X-Y)
62 ± 4 MPa
Bending Modulus
(X-Y)
1880 ± 110 MPa
Impact Strength
(X-Y)
39.3 ± 3.6 kJ/m²
Impact Strength
(notched)
21.5 ± 2.2 kJ/m²

Physical Properties

Diameter1.75 ± 0.03 mm
Net Filament Weight1 kg
Melting Temperature200 °C
Vicat Softening Temp94 °C
Heat Deflection Temp
(0.45 MPa)
87 °C
Heat Deflection Temp
(1.8 MPa)
84 °C
Water Absorption
(25°C, 55% RH)
0.65 %
SpoolPC + ABS, reusable (90 °C resistant)

Print Settings

Nozzle Temperature240 - 270 °C
Bed Temperature80 - 100 °C
Chamber Temperature45 - 60 °C
Printing Speed< 300 mm/s
Cooling Fan0 - 80 %
Drying
(Blast Drying Oven)
80 °C for 8 h
Storage Humidity< 20% RH (sealed, with desiccant)
Build PlateEngineering / High Temp / Textured PEI + glue

Compatibility

Printer TypeFDM — enclosure required
AMS CompatibilityAMS 2 Pro, AMS HT & AMS (NOT AMS lite)
MaterialABS

About This Product

Bambu Lab ABS is a dependable engineering filament known for stability, durability and high impact resistance. It is stronger than normal PLA and PETG, holds its shape to an 87°C heat deflection temperature, and resists water and UV — making it ideal for functional parts, prototypes and everyday engineering components. Bambu tuned this formula to reduce the warping and cracking classic ABS is known for, while keeping outstanding impact strength (39.3 kJ/m²) and good flow for high-speed printing. Ships on a 1KG RFID reusable spool; requires an enclosed printer.